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    Automated FOUP Cleaner
    The fully automatic FOUP cleaning machine is designed for 12-inch production lines and integrates with AMHS crane systems for efficient cleaning and transport. It is ideal for semiconductor applications, including silicon substrates and advanced packaging, meeting strict FOUP/FOSB metal ion and particle cleaning standards.
    With a multi-stage high-precision filtration system and various spray combinations for 360° coverage, it ensures thorough cleaning. The built-in vacuum drying and dehumidification system enhances efficiency, meeting low-humidity requirements with optional real-time monitoring.
    - Supports EAP/MES/FDC communication protocols, SECS/GEM 200/300
    - Compatible with OHT/PGV/AGV systems
    - Complies with SEMI S2, 47, and CE standards and certifications
    Automated FOUP Cleaner
    Automated FOUP Cleaner
    产品特点
    01
    Each chamber operates independently and can be adjusted according to process needs, enhancing production efficiency. The sealed design isolates the chambers from external contaminants, ensuring a continuously clean environment and effectively maintaining FOUP cleanliness after cleaning.
    02
    The equipment integrates an N2 filling system and humidity detection for the FOUP, allowing continuous monitoring and improvement of environmental conditions to prevent secondary contamination after cleaning.
    03
    Equipped with an advanced vacuum dehumidification system, it ensures the internal humidity of the FOUP reaches extremely low levels, meeting the stringent humidity control standards of the semiconductor industry.
    04
    The automatic Load Port design, combined with the E84 sensor, ensures stability and smooth integration with the OHT (automated crane system), automating the entire production process.
    05
    The optional Slot Mapping system allows real-time monitoring within the FOUP, detecting unremoved wafers and any potential wafer fragments, ensuring production safety and accuracy.
    06
    The equipment combines an industrial PC and PLC for simple and convenient operation, supporting SECS/GEM communication protocols to meet the intelligent demands of semiconductor production lines.
    应用范围
    12″ FOSB
    12″ FOSB
    透明的晶圆出货盒
    12″ Wafer FOUP
    12″ Wafer FOUP
    非透明的半导体晶圆转运盒
    技术参数
    Equipment size
    L4250 x W3110 x H2720 mm
    (including foot cup + exhaust port height) for reference only
    Scope of application
    12”Wafer FOUP/FOSB；Panel FOUP；Mask FOUP
    Jig Type
    Accroding to customer's wafer carrier（Max. 12inch FOUP)
    FPH
    ≥ 25ea/H（12inch FOUP）
    Equipment stability
    UP Time ＞99%；MTBF＞2000H；MTBA＞168H；MTTR＜3H
    Particle Control
    SP3/SP5 surface scanning Bare Wafer that incease＜20ea@0.04um（Except edge 3mm）
    Metal ion test
    ＜10PPT（Li, Na, Mg, Al, K, Ca, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Sr, Mo, Ba, W, Pb, Au, Ag）IPC-MS test
    AMC test
    NH3＜10ppbv；Total acids＜1ppbv；Amines＜1ppbv；SO2＜1ppbv；VOC＜400ppbv
    Gross power
    MAX. 110KW
    Net weight of equipment
    About 4000Kg
    Main material
    Body: Mirror SUS304;  Pipeline: PFA
    公海555000
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